I. Why Choose JC Electromagnetic Iron Remover for Monocrystalline Silicon Purification?
Photovoltaic-grade monocrystalline silicon has strict purity requirements, with the total content of metal impurities ≤0.5ppb and iron impurities ≤0.05ppb. During its production process (melting materials, drawing, cutting, and cleaning), equipment wear (such as graphite crucible debris), and pipeline rust can easily introduce ferromagnetic impurities. These impurities can form "deep-level traps", reducing the lifetime of photogenerated carriers and leading to a decline in battery efficiency and chipping of silicon wafers.
The JC electromagnetic iron remover specifically addresses pain points: Firstly, it generates a high-gradient magnetic field of 3,500 to 45,000 Gauss through "nano-scale magnetic conductive medium + multi-segment magnetic circuit", which can adsorb ultra-fine iron impurities of 0.003mm, meeting the purity standards. Second, the 316L stainless steel contact parts are resistant to corrosion by hydrofluoric acid and nitric acid, making them suitable for cleaning processes. Thirdly, it supports dual-form treatment of "dust + slurry", seamlessly integrating into the post-drawing and pre-processing procedures to prevent impurities from being re-mixed.
II. Improved Effects After Application
Before introducing the JC Electromagnetic Iron Remover, a monocrystalline silicon PV enterprise faced fluctuations in the photoelectric conversion efficiency of monocrystalline silicon wafers (average efficiency ≤24.5%) due to excessive iron impurities. Additionally, manual screening of silicon material was required every 6 hours, resulting in a daily labor cost of over 1,500 yuan for a single production line, and the edge chipping rate of silicon wafers reached 3.2%. After applying the JC Electromagnetic Iron Remover, three core improvements were achieved:
- Dual Improvement in Purity and Efficiency: The iron content of monocrystalline silicon is stably controlled within 0.04ppb, and the photoelectric conversion efficiency of silicon wafers is increased to over 25.3%, meeting the raw material requirements for HJT and TOPCon high-efficiency cells, with a 10% increase in product premium rate.
- Optimization of Production Yield: The edge chipping rate of silicon wafers decreased from 3.2% to 0.8%, reducing the monthly loss from silicon wafer scrapping by approximately 42,000 yuan for a single production line. The equipment operates continuously without failure for over 4,500 hours, and the shutdown maintenance rate decreased by 92%.
- Reduction in Cost Loss: Automatic iron removal replaces manual screening, saving 1,500 yuan in daily labor costs. At the same time, it avoids damage to the heating system of the single crystal furnace caused by iron impurities, extending the equipment service life by 4-6 years and reducing equipment maintenance costs by 30%.
III. Advantages and Features
(1) Ultra-Clean Iron Removal and Low-Damage Adaptation
Targeting the "high brittleness and hardness, easy damage" characteristics of monocrystalline silicon, the JC Electromagnetic Iron Remover adopts "flexible magnetic adsorption technology": the surface of the magnetic medium is coated with a 0.1mm-thick polytetrafluoroethylene layer to avoid silicon material damage caused by direct friction between silicon material and magnets. Additionally, it is equipped with a "graded slag discharge system" that automatically adjusts the slag discharge frequency according to the adsorption amount of iron impurities, reducing silicon material loss along with impurities. The silicon material recovery rate is increased to over 99.5%, far higher than the industry average.
(2) Low Interference and Full-Process Traceability
Firstly, it adopts an "electromagnetic shielding design". Through a multi-layer permalloy shielding cover, the equipment's electromagnetic radiation is controlled within ≤3μT, avoiding interference with the detection accuracy of precision testing instruments (such as minority carrier lifetime testers) in monocrystalline silicon production. Secondly, it is equipped with an "IoT intelligent control system" that can real-time monitor parameters such as magnetic field strength, silicon material processing capacity, and equipment temperature. It automatically generates the "Iron Removal Effect Traceability Report", recording the iron removal time and iron content changes of each batch of silicon material, meeting the requirements of the PV industry's ISO 9001 quality management system and facilitating product quality traceability.
IV. Product Attribute Table
V. QA
Q1: When the JC Electromagnetic Iron Remover processes monocrystalline silicon, will the magnetic field change the crystal structure of monocrystalline silicon?
A1: No. The crystal structure of monocrystalline silicon is determined by the atomic arrangement. The magnetic field of the JC Electromagnetic Iron Remover only exerts adsorption force on ferromagnetic impurities such as iron and nickel, and does not affect the atomic arrangement of monocrystalline silicon or change its electrical properties, ensuring that the original crystal quality of monocrystalline silicon remains undamaged.
Q2: Monocrystalline silicon production requires 24-hour continuous pulling. Can the JC Electromagnetic Iron Remover meet the uninterrupted iron removal needs of the production line?
A2: Absolutely. The equipment adopts a "dual magnetic system rotation design". When one set of magnetic systems reaches the threshold for iron impurity adsorption, the other set automatically switches to work. Slag discharge does not require shutdown, enabling 24-hour continuous iron removal. Additionally, it is equipped with a backup cooling system to handle sudden failures, ensuring uninterrupted iron removal and matching the continuous production rhythm of monocrystalline silicon.
Q3: The space of existing monocrystalline silicon production lines is limited. Does the installation of the JC Electromagnetic Iron Remover require adjusting the original equipment layout?
A3: No major adjustments are needed. The equipment adopts a "modular compact design". The smallest model (with a medium cylinder inner diameter of 100mm) covers an area of only 0.8㎡, and can be installed in a suspended or floor-mounted manner according to the production line space. The inlet and outlet ports are compatible with industry-standard DN50-DN400 pipeline interfaces, enabling quick connection with existing conveying systems. A professional team can complete installation and commissioning within one day, with minimal impact on the normal production of the line.
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